Increased layer technology and OLED growth driving demand for silicon parts

增层技术和 OLED的增长推动了硅零部件的需求

The electronic materials advisory firm providing business and technology information— is forecasting revenues for Silicon Fabricated Parts to decrease by 5% in 2023, reaching a total of US$856 million. This slowdown is due to overall downtrends within the semiconductor industry, alongside lower numbers of wafer starts. TECHCET is forecasting a sharp rebound of near 11% for the Silicon Parts market in 2024, as explained in the newly released Silicon Parts Critical Materials Report™.

提供商业和技术信息的电子材料咨询公司预计2023年硅制造零部件的收入将减少5%，总收入达到8.56亿美元。此次放缓是由于半导体行业整体下滑以及晶圆开工数量减少所致。正如新发布的硅零部件关键材料报告™中所解释的那样，TECHCET预测2024年硅零部件市场将大幅反弹近11%。

Silicon parts purchases from OEM’s for new etch and deposition tools grew in 2022 to make up about 50% of all sales. This increase in OEM purchases was due to higher demand for equipment. OEM tool sales are expected to ease over the next 2 years as demand from chip fabs for spare parts increases.

2022年，从OEM购买的用于新型蚀刻和沉积设备的硅零部件数量有所增长，约占总销售额的50%。OEM采购量的增加是由于设备需求的增加。随着芯片工厂对备件需求增加，预计OEM设备销售将在未来两年内放缓。

Over the past decade, global polysilicon production capacity has ramped significantly, from 30,000 or so metric tons in the 2000s, to almost 700,000 metric tons currently. However, demand for silicon parts continues to steadily grow, requiring even more additional capacity needs. Beyond 2023, supply tightness for silicon parts is currently expected as etch and deposition steps increase for 3DNAND and leading-edge logic devices. Additionally, strong growth in the OLED market may cause supply chain problems for silicon parts equipment. Semiconductor equipment companies may consider buying parts in advance to alleviate future supply chain bottlenecks.

过去十年，全球多晶硅产能大幅增长，从21世纪00年代的3万吨左右，增至目前的近70万吨。然而，硅零部件的需求持续稳定增长，需要更多的额外产能。2023年以后，随着3DNAND和前沿逻辑器件的蚀刻和沉积步骤的增加，预计硅零部件的供应会变得紧张。此外，OLED市场的强劲增长可能会导致硅零部件设备的供应链出现问题。半导体设备公司可能会考虑提前购买零部件，以缓解未来的供应链瓶颈。

Higher pricing and lead time issues may also occur without silicon parts capacity increasing. As long-term purchase agreements expire, the price of raw materials have gone up for major suppliers. Additionally, inflation, logistics, and labor shortages will all play a role on the silicon parts segment going forward.

如果不增加硅零部件的产能，也可能会出现定价提高和交货时间延误的问题。随着长期采购协议到期，主要供应商的原材料价格会上涨。此外，通货膨胀、物流和劳动力短缺都将对硅零部件领域的未来产生影响。

【近期会议】

8月31日14:00于线上举办的“先进封装技术之设计、材料、工艺新发展”主题会议！期待您的准时上线参会！ 报名链接：https://w.lwc.cn/s/zm6fAr

9月8日14:00，将举办“失效分析-半导体材料和器件故障诊断的火眼金睛”专题会议。诚邀您报名参会：https://w.lwc.cn/s/eIjMjq

9月21-22日，厦门云天半导体将联合厦门大学主办“首届半导体先进封测产业技术创新大会”。目前招观招商正在火热进行中，听众注册：https://w.lwc.cn/s/qEzy63

11月1日-2日，雅时国际商讯联合太仓市科技招商有限公司即将举办“2023化合物半导体先进技术及应用大会”。诚邀您相聚江苏太仓，筑创产业新未来。听众注册：https://w.lwc.cn/s/yqMZ7f